Agenda

This will be a short meeting as we have interviews at 2:30pm

Time/Location

1:30 PM Wed 28-Oct-2009 CC F326

1:30 PM Wed 11-Nov-2009

Attendees: Elliott W, Mark I, Chris, C, Ben R, Simon T, William G, Fernando B, Beni Z.

SSP Board Design

Ben gave a brief overview of progress on SSP board design.

Front panel includes NIM and differential inputs.
8 fiber transceivers per board.
CLAS will use a different version of the board, one SSP per sector.
Board layout is preliminary, all major components placed, minor ones not placed yet.
Firmware has been simulated.

ASIC and SiPM Update

Fernando gave an update on the ASIC preamp and SiPM efforts. See GlueX docs 1364 (ASIC) and 1370 (SiPM).

ASIC and board ready for production, all features included (incl. dual gain).
Boards pass all tests, look very good.
Have 40 new ASICS with correct wire bonding plus old ones with faulty bond.
Need 2000 for final system.
Hamamatsu has delivered 10 4x4 SiPM arrays (1.2 cm square), still waiting for SensL (deadline early Nov).
Ceramic carrier, no cooling needed, but temperature stabilization needed.
81% coverage, SensL will be slightly less.
50 micron pixels.
Initial testing very good, meets all specs, cost in our range.
Large SiPM array capacitance is typically high, not much can be done about it.
Get 13 ns risetime for 5 ns input, 76 ns width.
Carl Zorn will perform extensive tests on all 10 SiPM's.
Gain about 10**6, noise ok.

Electronics Update

Chris gave an update on the remaining electronics efforts.

All projects well defined and moving along according to schedule, manpower ok.
Version 2 of TDC and ADC coming up, serious work to begin by March 2010.
Work on global trigger boards (GTP, SSP) in progress.
TS board will be worked on in the next fiscal year, DAQ group heavily involved.
Chris is working on early VXS crate procurement for all halls, order perhaps in Spring 2010.