Difference between revisions of "May 5, 2011 SiPM Electrical and Cooling"
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# Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories. | # Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories. | ||
| + | #* Suggested mods to mechanical: make SiPM holder one piece (instead of 4), increase thickness of holder to 3/8", increase size of thermal plate to cover all amplifiers. | ||
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== Tentative Agenda == | == Tentative Agenda == | ||
Revision as of 07:25, 29 April 2011
References
Action Items from previous meetings
- Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories.
- Suggested mods to mechanical: make SiPM holder one piece (instead of 4), increase thickness of holder to 3/8", increase size of thermal plate to cover all amplifiers.
Tentative Agenda
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- SiPM testing (Carl and Yi)
- Acceptance of First Article
- Mechanical cooling (Jim)
- Mechanical drawings (Chuck)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
- Will present a discussion of cabling and grounding next week.
- Discussion of production testing
Minutes
Attending:
