Difference between revisions of "May 5, 2011 SiPM Electrical and Cooling"
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(→Tentative Agenda) |
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# Schedule, reporting, and manpower (Elton) | # Schedule, reporting, and manpower (Elton) | ||
# SiPM testing (Carl and Yi) | # SiPM testing (Carl and Yi) | ||
| − | + | # Mechanical (Jim) | |
| − | # Mechanical | + | |
# Mechanical drawings (Chuck) | # Mechanical drawings (Chuck) | ||
| + | # Geometry (Elton) | ||
# Temperature compensation (Jack) | # Temperature compensation (Jack) | ||
# Preamp-summing (Fernando) | # Preamp-summing (Fernando) | ||
#* Will present a discussion of cabling and grounding next week. | #* Will present a discussion of cabling and grounding next week. | ||
| − | |||
== Minutes == | == Minutes == | ||
''Attending: | ''Attending: | ||
Revision as of 17:21, 4 May 2011
References
Action Items from previous meetings
- Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories.
- Suggested mods to mechanical: make SiPM holder one piece (instead of 4), increase thickness of holder to 3/8", increase size of thermal plate to cover all amplifiers.
Tentative Agenda
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- SiPM testing (Carl and Yi)
- Mechanical (Jim)
- Mechanical drawings (Chuck)
- Geometry (Elton)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
- Will present a discussion of cabling and grounding next week.
Minutes
Attending:
