Difference between revisions of "May 5, 2011 SiPM Electrical and Cooling"
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# Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories. | # Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories. | ||
| − | # | + | # <strike> Suggested mods to mechanical: make SiPM holder one piece (instead of 4), increase thickness of holder to 3/16", increase length of heat spreader to cover all amplifiers. </strike> |
| − | # | + | # Check bowing with FEA |
== Tentative Agenda == | == Tentative Agenda == | ||
Revision as of 15:10, 5 May 2011
References
Action Items from previous meetings
- Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories.
-
Suggested mods to mechanical: make SiPM holder one piece (instead of 4), increase thickness of holder to 3/16", increase length of heat spreader to cover all amplifiers. - Check bowing with FEA
Tentative Agenda
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- SiPM testing (Carl and Yi)
- Mechanical (Jim)
- Mechanical drawings (Chuck)
- Geometry (Elton)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
- Will present a discussion of cabling and grounding next week.
Minutes
Attending:
