Difference between revisions of "Apr 28, 2011 SiPM Electrical and Cooling"
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# Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories. | # Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories. | ||
| + | # Retest one of the original arrays to verify new setup reproduces previous results | ||
== Tentative Agenda == | == Tentative Agenda == | ||
Revision as of 17:12, 14 April 2011
References
Action Items from previous meetings
- Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories.
- Retest one of the original arrays to verify new setup reproduces previous results
Tentative Agenda
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- SiPM testing (Carl and Yi)
- Mechanical cooling (Jim)
- Review status of drawings for prototype (Chuck)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
- Will present a discussion of cabling and grounding next week.
- Discussion of production testing
Minutes
Attending:
