Revision as of 15:45, 25 August 2011

August 25, 2011 FDC meeting

Agenda

Production Construction Tracking (Dave)
- Status
- HV cap problem: [1],[2],[3],[4],[5]
Engineering (Bill)
- Stack assembly procedure
- Wire deadening images
- Gusset ring
- Other
Electronics update (Chris)
Chamber testing at EEL126 (cell#2) (Beni)
- Results with new gas mixture: [6]
Other: how to assemble a package

@@ Line 23: / Line 23: @@
 == Production ==
-- Dave: yesterday finished with stringing and taping wire frame #6, today did the position measurements and by the evening the wires will be glued.
+- Dave: yesterday finished with stringing and taping wire frame #6, today did the position measurements and by the end of the day the wires will be glued. The cutter is now again operational and the techs will continue with cutting the foils for the cathode set #7; working also on the flaps for the cathode type 2 from set #6.
+- HV cap problem (see pictures linked above). Everybody was surprised by the size and the abundance of the solder balls: 1-2mm (compared to the gap of 4.5mm between the pads) under more than 50% of the caps. This is the result from two wire frames that were re-soldered by Anatoly. The leakage current after re-soldering went down to several nA for the whole frame.