Difference between revisions of "April 12, 2011 SiPM Electrical and Cooling"
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# Schedule, reporting, and manpower (Elton) | # Schedule, reporting, and manpower (Elton) | ||
# SiPM production testing (everyone) | # SiPM production testing (everyone) | ||
+ | #* Software updated to latest changes | ||
+ | #* Cable for temperature sensor (borrowed for mini-Bcal) has been replaced | ||
+ | #* Chiller is being refilled with liquid | ||
+ | #* Bobby, Tom and Elton will meet with Yi to learn how to operate the system | ||
# Mechanical assembly (Scot) | # Mechanical assembly (Scot) | ||
# Mechanical (Jim) | # Mechanical (Jim) | ||
+ | #* Showed latest thermal FEA calculations | ||
+ | #* Model has ss standoffs and plastic washer to isolate the cooling plate from the spreader board | ||
+ | #* The connections to the 4-wire RTD needs to be finalized including connections through the top plate. Could possibly use the connector used for power | ||
+ | #* Currently the model shows a variation of 0.8 deg C across the cooling plate. Changing the standoffs to plastic reduces the gradient from 0.8 to o.6 deg C. | ||
+ | #* Two watts of heat is conducted from the spreader plate down to the cooling plate | ||
+ | #* The cooling plate dissipates 12 W, 10 W is convective heat load | ||
+ | #* Maximum temperature on the spreader plate is about 50 deg C. | ||
+ | #* It will be useful to study the temperature gradients on the mini-Bcal readout after removing from Hall B. | ||
# Mechanical drawings (Chuck) | # Mechanical drawings (Chuck) | ||
# Temperature compensation (Jack) | # Temperature compensation (Jack) | ||
− | # Preamp-summing ( | + | #* Difficulty finding higher precision resistors. |
+ | #* Final optimization will occur once the operating point is determined for the SiPMs (from beamtest) | ||
+ | #* Fernando: may also wish to revisit the standing current in the chain | ||
+ | # Preamp-summing (Fernando) | ||
+ | #* Ringing on boards has been found (first in the EEL and also in the beam test data) | ||
+ | #* Did not previously look for it on the bench | ||
+ | #* Third wedge is almost assembled and will be used to diagnose the ringing problem. | ||
+ | #* Data from the beam test with one bias on at a time is being studied for clues to the problem. | ||
+ | #* PS is now under new software control in F117 |
Latest revision as of 17:13, 12 April 2012
Action Items from previous meetings
- Determine if swapped bias pins was accidental or in design (Chris)
- Develop front and back views of jumper sheets. Also get latest version of drawings (Jack)
- Request Hamamatsu data sheets from Chile to be used as input to jumper settings for boards (Elton)
-
Double-check that the jumper settings for #37 (U-board counting) are correct (Jack) -
Provide section views of board to Fernando (Jim) -
Run temperature configuration for cooling plate with new geometry (Jim) -
When design is complete, order 2 mechanical assemblies with latest geometry (Jim)In progress as design is finalized -
Populate SiPM wedge board to be used for checking electrical issues (Fernando and Chris)
Tentative Agenda
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- SiPM production testing (everyone)
- Mechanical assembly (Scot)
- Mechanical (Jim)
- Mechanical drawings (Chuck)
- Temperature compensation (Jack)
- Preamp-summing (Chris)
Minutes
Attending: Fernando, Eugene, Elton, Jim, Nick, Andrei, Tim, Jack
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- SiPM production testing (everyone)
- Software updated to latest changes
- Cable for temperature sensor (borrowed for mini-Bcal) has been replaced
- Chiller is being refilled with liquid
- Bobby, Tom and Elton will meet with Yi to learn how to operate the system
- Mechanical assembly (Scot)
- Mechanical (Jim)
- Showed latest thermal FEA calculations
- Model has ss standoffs and plastic washer to isolate the cooling plate from the spreader board
- The connections to the 4-wire RTD needs to be finalized including connections through the top plate. Could possibly use the connector used for power
- Currently the model shows a variation of 0.8 deg C across the cooling plate. Changing the standoffs to plastic reduces the gradient from 0.8 to o.6 deg C.
- Two watts of heat is conducted from the spreader plate down to the cooling plate
- The cooling plate dissipates 12 W, 10 W is convective heat load
- Maximum temperature on the spreader plate is about 50 deg C.
- It will be useful to study the temperature gradients on the mini-Bcal readout after removing from Hall B.
- Mechanical drawings (Chuck)
- Temperature compensation (Jack)
- Difficulty finding higher precision resistors.
- Final optimization will occur once the operating point is determined for the SiPMs (from beamtest)
- Fernando: may also wish to revisit the standing current in the chain
- Preamp-summing (Fernando)
- Ringing on boards has been found (first in the EEL and also in the beam test data)
- Did not previously look for it on the bench
- Third wedge is almost assembled and will be used to diagnose the ringing problem.
- Data from the beam test with one bias on at a time is being studied for clues to the problem.
- PS is now under new software control in F117