Difference between revisions of "Dec 5, 2011 SiPM Electrical and Cooling"
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# Make a metal die to punch holes in cooling mat to ease assembly. (Nick and Jim) | # Make a metal die to punch holes in cooling mat to ease assembly. (Nick and Jim) | ||
# Give Jim a U-board with defective SiPM for devising extraction tool (Nick and Yi) | # Give Jim a U-board with defective SiPM for devising extraction tool (Nick and Yi) | ||
+ | # Determine granularity of LED bias and power, as well as multiplicity of trigger signals (Elton) | ||
== Tentative Agenda == | == Tentative Agenda == |
Revision as of 16:09, 1 November 2012
Action Items from previous meetings
- Decide on cable connections for monitoring cable from Bcal wedge to patch panel. Consider electronics needed for pulsing system (Elton and Fernando)
- Make a metal die to punch holes in cooling mat to ease assembly. (Nick and Jim)
- Give Jim a U-board with defective SiPM for devising extraction tool (Nick and Yi)
- Determine granularity of LED bias and power, as well as multiplicity of trigger signals (Elton)
Tentative Agenda
- Announcements
- Action Items
- Schedule for production and testing (all)
- mini-Bcal (Elton)
- SiPM production testing (Yi)
- Mechanical assembly (Jim)
- Temperature compensation (Jack)
- Electronic boards (Fernando and Chris)
- Light guide gluing setup (Scot)
Minutes
Attending: