Difference between revisions of "May 5, 2011 SiPM Electrical and Cooling"
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# Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories. | # Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories. | ||
# <strike> Suggested mods to mechanical: make SiPM holder one piece (instead of 4), increase thickness of holder to 3/16", increase length of heat spreader to cover all amplifiers. </strike> | # <strike> Suggested mods to mechanical: make SiPM holder one piece (instead of 4), increase thickness of holder to 3/16", increase length of heat spreader to cover all amplifiers. </strike> | ||
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== Tentative Agenda == | == Tentative Agenda == | ||
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== Minutes == | == Minutes == | ||
| − | ''Attending: | + | ''Attending: Jim, Jack, Elton, Carl, Yi, Fernando, John, Eugene |
| + | |||
| + | # Announcements | ||
| + | # Action Items | ||
| + | # Schedule, reporting, and manpower (Elton) | ||
| + | # SiPM testing (Carl and Yi) | ||
| + | # Mechanical (Jim) | ||
| + | # Mechanical drawings (Chuck) | ||
| + | # Geometry (Elton) | ||
| + | # Temperature compensation (Jack) | ||
| + | # Preamp-summing (Fernando) | ||
| + | #*Fernando presented an overview of the grounding scheme for the readout, which has three grounds: a) amp/sum/bias ground, b) monitoring ground c) chassis. | ||
Revision as of 17:56, 5 May 2011
References
Action Items from previous meetings
- Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories.
-
Suggested mods to mechanical: make SiPM holder one piece (instead of 4), increase thickness of holder to 3/16", increase length of heat spreader to cover all amplifiers.
Tentative Agenda
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- SiPM testing (Carl and Yi)
- Mechanical (Jim)
- Mechanical drawings (Chuck)
- Geometry (Elton)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
- Will present a discussion of cabling and grounding next week.
Minutes
Attending: Jim, Jack, Elton, Carl, Yi, Fernando, John, Eugene
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- SiPM testing (Carl and Yi)
- Mechanical (Jim)
- Mechanical drawings (Chuck)
- Geometry (Elton)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
- Fernando presented an overview of the grounding scheme for the readout, which has three grounds: a) amp/sum/bias ground, b) monitoring ground c) chassis.
