Difference between revisions of "Nov 1, 2011 SiPM Electrical and Cooling"
From GlueXWiki
(→Action Items from previous meetings) |
(→Action Items from previous meetings) |
||
Line 5: | Line 5: | ||
# Make a metal die to punch holes in cooling mat to ease assembly. (Nick and Jim) | # Make a metal die to punch holes in cooling mat to ease assembly. (Nick and Jim) | ||
# Produce jumper settings for first article boards next week (Jack) | # Produce jumper settings for first article boards next week (Jack) | ||
− | # Provide list of SiPMs on the mini-Bcal to Jack (Elton) | + | # <strike> Provide list of SiPMs on the mini-Bcal to Jack (Elton) </strike> |
# Give Jim a U-board with defective SiPM for devising extraction tool | # Give Jim a U-board with defective SiPM for devising extraction tool | ||
Revision as of 16:33, 18 October 2012
Action Items from previous meetings
- Decide on cable connections for monitoring cable from Bcal wedge to patch panel. Consider electronics needed for pulsing system (Elton and Fernando)
- Check uniformity of LED source in black testing box
- Make a metal die to punch holes in cooling mat to ease assembly. (Nick and Jim)
- Produce jumper settings for first article boards next week (Jack)
-
Provide list of SiPMs on the mini-Bcal to Jack (Elton) - Give Jim a U-board with defective SiPM for devising extraction tool
Tentative Agenda
- Announcements
- Action Items
- Schedule for production and testing (all)
- Schedule for production (Fernando and Jim)
- Schedule for SiPM assignment and jumper sheets
- mini-Bcal (Elton)
- SiPM production testing (Yi)
- Mechanical assembly (Jim)
- Temperature compensation (Jack)
- Electronic boards (Fernando and Chris)
- U-board puller?
- Light guide gluing setup (Scot)
Minutes
Attending: