Difference between revisions of "Dec 5, 2011 SiPM Electrical and Cooling"
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#* A/C unit has been installed and is working great. No condensation on cooling tubes at 5 degC. Note: RH~38% at 10 degC. | #* A/C unit has been installed and is working great. No condensation on cooling tubes at 5 degC. Note: RH~38% at 10 degC. | ||
# Mechanical assembly (Jim) | # Mechanical assembly (Jim) | ||
− | #* All (mechanical) parts are expected before the break | + | #* All (mechanical) parts are expected to arrive before the break |
#* They still need to be sent out for anodizing. They will be sent out as soon as they come in. | #* They still need to be sent out for anodizing. They will be sent out as soon as they come in. | ||
#* There are still hardware items that need to be ordered from McMaster Carr | #* There are still hardware items that need to be ordered from McMaster Carr | ||
# Temperature compensation (Jack) | # Temperature compensation (Jack) | ||
+ | #* Jack is planning to make the jumper maps next week. | ||
+ | ## Sensors with high dark rate | ||
+ | ##* A question was raised by USM on Tuesday regarding some sensors that have unusually high dark rate. They have identified about 25 such units so far. | ||
+ | ##* We want to make a decision, so that Jack can make the final jumper maps. | ||
+ | ##* Our tentative suggestion is to place the units with high dark rate in the outer layer in the sum of four. Elton will confirm this decision before next week. | ||
+ | ## Numbering | ||
+ | ##* Jack questioned how to number the electronic boards. One possibility was 1-96 with Up being odd and Down being even. A second possibility was U1-U48 and D1-D48. | ||
+ | ##* Elton and Chris agree that the second option (U1-U48, D1-D48) was more natural. Will confirm with Fernando that we should go this way. | ||
# Electronic boards (Fernando and Chris) | # Electronic boards (Fernando and Chris) | ||
+ | #* Still waiting on the first article to arrive. We have the jumper maps for these boards. | ||
# Light guide gluing setup (Scot) | # Light guide gluing setup (Scot) |
Revision as of 17:39, 6 December 2012
Action Items from previous meetings
-
Decide on cable connections for monitoring cable from Bcal wedge to patch panel. Consider electronics needed for pulsing system (Elton and Fernando)Decided to have a separate patch panel, which allows decisions on these other items to a later date -
Make a metal die to punch holes in cooling mat to ease assembly. (Nick and Jim) -
Give Jim a U-board with defective SiPM for devising extraction tool (Nick and Yi) -
Determine granularity of LED bias and power, as well as multiplicity of trigger signals (Elton) -
Check on official releases of the 3D model (Elton and Jim)All items will have a drawing. 3D models will be tagged in directories on the group disk.
Tentative Agenda
- Announcements
- Action Items
- Schedule for production and testing (all)
- mini-Bcal (Elton)
- SiPM production testing (Yi)
- Mechanical assembly (Jim)
- Temperature compensation (Jack)
- Electronic boards (Fernando and Chris)
- Light guide gluing setup (Scot)
Minutes
Attending: Jim, Elton, Nic, Jim, Ivan, Yi, Chris
- Announcements
- Action Items
- Schedule for production and testing (all)
- Light guides
- Approximately 1400 have been delivered and 400 more arrived today.
- Manpower for the gluing has been identified, but will start the week before the break
- Will check that tooling does the job and start some dry tests before starting. If necessary make any modifications to procedures/setup.
- Bcal assemblies (mechanical)
- List and sequence of pre-assembly tasks was generated by Elton, Chris, Nic and Jim following the meeting proper (see next)
- A better estimate for total time to complete the pre-assembly tasks is needed. However, it clearly needs dedicated manpower next month to complete the tasks by February
- List of mechanical pre-assembly tasks
- Fabricate Cooling Tubing Assembly (Note: fixturing is complete but not tested)
- Cut
- Braze fittings onto tube
- Bend tube
- leak test fittings
- Gluing
- glue tube into cooling plate
- glue thermistor onto boards
- glue RTD assembly. (Note: Chris needs to provide RTDs with wires soldered already)
- install 2 tube clamps onto plate
- Assemble/sort
- insert threaded rods into spacers
- sort hardware into labeled bins for use during assembly
- Fabricate Cooling Tubing Assembly (Note: fixturing is complete but not tested)
- Light guides
- mini-Bcal (Elton)
- SiPM production testing (Ivan and Yi)
- A/C unit has been installed and is working great. No condensation on cooling tubes at 5 degC. Note: RH~38% at 10 degC.
- Mechanical assembly (Jim)
- All (mechanical) parts are expected to arrive before the break
- They still need to be sent out for anodizing. They will be sent out as soon as they come in.
- There are still hardware items that need to be ordered from McMaster Carr
- Temperature compensation (Jack)
- Jack is planning to make the jumper maps next week.
- Sensors with high dark rate
- A question was raised by USM on Tuesday regarding some sensors that have unusually high dark rate. They have identified about 25 such units so far.
- We want to make a decision, so that Jack can make the final jumper maps.
- Our tentative suggestion is to place the units with high dark rate in the outer layer in the sum of four. Elton will confirm this decision before next week.
- Numbering
- Jack questioned how to number the electronic boards. One possibility was 1-96 with Up being odd and Down being even. A second possibility was U1-U48 and D1-D48.
- Elton and Chris agree that the second option (U1-U48, D1-D48) was more natural. Will confirm with Fernando that we should go this way.
- Electronic boards (Fernando and Chris)
- Still waiting on the first article to arrive. We have the jumper maps for these boards.
- Light guide gluing setup (Scot)