May 5, 2011 SiPM Electrical and Cooling

Action Items from previous meetings

1. Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories.
   • Suggested mods to mechanical: make SiPM holder one piece (instead of 4), increase thickness of holder to 3/8", increase size of thermal plate to cover all amplifiers.

Tentative Agenda

1. Announcements
2. Action Items
3. Schedule, reporting, and manpower (Elton)
4. SiPM testing (Carl and Yi)
   • Acceptance of First Article
5. Mechanical cooling (Jim)
6. Mechanical drawings (Chuck)
7. Temperature compensation (Jack)
8. Preamp-summing (Fernando)
   • Will present a discussion of cabling and grounding next week.
9. Discussion of production testing

Minutes

Attending: