May 5, 2011 SiPM Electrical and Cooling
From GlueXWiki
References
Action Items from previous meetings
- Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories.
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Suggested mods to mechanical: make SiPM holder one piece (instead of 4), increase thickness of holder to 3/16", increase length of heat spreader to cover all amplifiers.
Tentative Agenda
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- SiPM testing (Carl and Yi)
- Mechanical (Jim)
- Mechanical drawings (Chuck)
- Geometry (Elton)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
- Will present a discussion of cabling and grounding next week.
Minutes
Attending: Jim, Jack, Elton, Carl, Yi, Fernando, John, Eugene
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- SiPM testing (Carl and Yi)
- Mechanical (Jim)
- Mechanical drawings (Chuck)
- Geometry (Elton)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
- Fernando presented an overview of the grounding scheme for the readout, which has three grounds: a) amp/sum/bias ground, b) monitoring ground c) chassis.