May 5, 2011 SiPM Electrical and Cooling

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References

Action Items from previous meetings

  1. Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories.
  2. Suggested mods to mechanical: make SiPM holder one piece (instead of 4), increase thickness of holder to 3/16", increase length of heat spreader to cover all amplifiers.
  3. Check bowing with FEA
  4. PCB dummy power load for thermal test.

Tentative Agenda

  1. Announcements
  2. Action Items
  3. Schedule, reporting, and manpower (Elton)
  4. SiPM testing (Carl and Yi)
  5. Mechanical (Jim)
  6. Mechanical drawings (Chuck)
  7. Geometry (Elton)
  8. Temperature compensation (Jack)
  9. Preamp-summing (Fernando)
    • Will present a discussion of cabling and grounding next week.

Minutes

Attending:

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