Difference between revisions of "2020 Winter - 2021 Spring"
From GlueXWiki
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(→Non Hall Work) |
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= Non Hall Work = | = Non Hall Work = | ||
| − | # | + | # Testing spare DIRC modules |
| − | # | + | # Control and operation |
| − | # | + | #* Alarm modification strategy |
| − | # | + | #* Resolving (double checking) DIRC hole in occupancy before run starts |
| − | # | + | #* Dis-entangle DIRC interlock and interlock reset from FCAL and CCOM |
| − | # | + | #* Individual (stand alone) SiPM TDA offset |
| − | # | + | # Tile FPGA voltage regulation issue. |
| − | # | + | # Recover loan-out (Duke SOLID group) MOROC chips |
| + | |||
= Not-to-forget items = | = Not-to-forget items = | ||
#* Re-activate tile-temperature alarm for the south box c2r18 | #* Re-activate tile-temperature alarm for the south box c2r18 | ||
#* Including south box c2r18 fiber verification back into the DAQ starting procedure | #* Including south box c2r18 fiber verification back into the DAQ starting procedure | ||
Revision as of 12:32, 28 August 2020
Hall work
- Water level sensor installation
- Total: 2 days. 1 day testing + 1 day installation
- Darkening leak check
- Total: 1 day
- Modification on vent exit to reduce FPGA temperature
- Total: 3 days. 1 day diagnose, 1 day test and 1 day installation. Excluding time for designing time.
- DIRC Diffuser seal issue
- Total: 2 days. 1 day test and 1 day installation. Excluding time for water seal test
- Contaminated mirror replacement in north upper OB
- Total: 1 days. Uninstall + Disassembly: 1 day; mirror removal + setting up clean area, mirror gluing+ curing: 3 days; silicone seal + cleaning + assembly: 1 days; installation: 1 day. Excluding time for water seal test
- Inspect the south lower OB
- 1 day
- If mirror problem, adding 6 more days for mirror replacement.
- South box module c2r18 over current limit diagnosis work
Non Hall Work
- Testing spare DIRC modules
- Control and operation
- Alarm modification strategy
- Resolving (double checking) DIRC hole in occupancy before run starts
- Dis-entangle DIRC interlock and interlock reset from FCAL and CCOM
- Individual (stand alone) SiPM TDA offset
- Tile FPGA voltage regulation issue.
- Recover loan-out (Duke SOLID group) MOROC chips
Not-to-forget items
- Re-activate tile-temperature alarm for the south box c2r18
- Including south box c2r18 fiber verification back into the DAQ starting procedure
