April 12, 2011 SiPM Electrical and Cooling

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Action Items from previous meetings

  1. Determine if swapped bias pins was accidental or in design (Chris)
  2. Develop front and back views of jumper sheets. Also get latest version of drawings (Jack)
  3. Request Hamamatsu data sheets from Chile to be used as input to jumper settings for boards (Elton)
  4. Double-check that the jumper settings for #37 (U-board counting) are correct (Jack)
  5. Provide section views of board to Fernando (Jim)
  6. Run temperature configuration for cooling plate with new geometry (Jim)
  7. When design is complete, order 2 mechanical assemblies with latest geometry (Jim) In progress as design is finalized
  8. Populate SiPM wedge board to be used for checking electrical issues (Fernando and Chris)

Tentative Agenda

  1. Announcements
  2. Action Items
  3. Schedule, reporting, and manpower (Elton)
  4. SiPM production testing (everyone)
  5. Mechanical assembly (Scot)
  6. Mechanical (Jim)
  7. Mechanical drawings (Chuck)
  8. Temperature compensation (Jack)
  9. Preamp-summing (Chris)

Minutes

Attending: Fernando, Eugene, Elton, Jim, Nick, Andrei, Tim, Jack

  1. Announcements
  2. Action Items
  3. Schedule, reporting, and manpower (Elton)
  4. SiPM production testing (everyone)
  5. Mechanical assembly (Scot)
  6. Mechanical (Jim)
  7. Mechanical drawings (Chuck)
  8. Temperature compensation (Jack)
  9. Preamp-summing (Chris)
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