Difference between revisions of "Dec 5, 2011 SiPM Electrical and Cooling"
From GlueXWiki
(→Action Items from previous meetings) |
(→Action Items from previous meetings) |
||
Line 5: | Line 5: | ||
# Give Jim a U-board with defective SiPM for devising extraction tool (Nick and Yi) | # Give Jim a U-board with defective SiPM for devising extraction tool (Nick and Yi) | ||
# Determine granularity of LED bias and power, as well as multiplicity of trigger signals (Elton) | # Determine granularity of LED bias and power, as well as multiplicity of trigger signals (Elton) | ||
+ | # Check on official releases of the 3D model (Elton and Jim) | ||
== Tentative Agenda == | == Tentative Agenda == |
Revision as of 09:59, 2 November 2012
Action Items from previous meetings
- Decide on cable connections for monitoring cable from Bcal wedge to patch panel. Consider electronics needed for pulsing system (Elton and Fernando)
- Make a metal die to punch holes in cooling mat to ease assembly. (Nick and Jim)
- Give Jim a U-board with defective SiPM for devising extraction tool (Nick and Yi)
- Determine granularity of LED bias and power, as well as multiplicity of trigger signals (Elton)
- Check on official releases of the 3D model (Elton and Jim)
Tentative Agenda
- Announcements
- Action Items
- Schedule for production and testing (all)
- mini-Bcal (Elton)
- SiPM production testing (Yi)
- Mechanical assembly (Jim)
- Temperature compensation (Jack)
- Electronic boards (Fernando and Chris)
- Light guide gluing setup (Scot)
Minutes
Attending: