Difference between revisions of "Material specifications for FDC Redesign"

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We are pursuing a couple of options for reducing the thickness of the FDC packages.  The following items are common to both designs:
 
We are pursuing a couple of options for reducing the thickness of the FDC packages.  The following items are common to both designs:
  
# The thickness of the Kapton in each cathode plane is 25 microns
+
* The thickness of the Kapton in each cathode plane is 25 microns
# The thickness of the Copper in each cathode plane is 2 microns
+
 
# The strips are excluded from a 10 cm diameter region about the beam line
+
* The thickness of the Copper in each cathode plane is 2 microns
# There is one ground plane per cathode plane composed of 6.3 micron Mylar with 0.1 micron Aluminimum on each side of the Mylar
+
 
# The FDC frames in the inactive area are composed of a sandwich of E-glass/carbon fiber/rohacell composite, polyethylene spacers, and FR-4/G10 wire frames  
+
* The strips are excluded from a 10 cm diameter region about the beam line
as described in GlueX-doc-800.
+
 
# The chamber gas mixure is 40% Argon/60% CO2.
+
* There is one ground plane per cathode plane composed of 6.3 micron Mylar with 0.1 micron Aluminimum on each side of the Mylar
 +
 
 +
* The FDC frames in the inactive area are composed of a sandwich of E-glass/carbon fiber/rohacell composite, polyethylene spacers, and FR-4/G10 wire frames as described in GlueX-doc-800.
 +
 
 +
* The chamber gas mixure is 40% Argon/60% CO2.
  
 
The two options for the rest of the material are:
 
The two options for the rest of the material are:

Revision as of 15:13, 18 May 2007

We are pursuing a couple of options for reducing the thickness of the FDC packages. The following items are common to both designs:

  • The thickness of the Kapton in each cathode plane is 25 microns
  • The thickness of the Copper in each cathode plane is 2 microns
  • The strips are excluded from a 10 cm diameter region about the beam line
  • There is one ground plane per cathode plane composed of 6.3 micron Mylar with 0.1 micron Aluminimum on each side of the Mylar
  • The FDC frames in the inactive area are composed of a sandwich of E-glass/carbon fiber/rohacell composite, polyethylene spacers, and FR-4/G10 wire frames as described in GlueX-doc-800.
  • The chamber gas mixure is 40% Argon/60% CO2.

The two options for the rest of the material are:

  1. 5 mm thick low-density Rohacell backing in the active region with a 10 cm diameter hole cut out of the center (including the copper and Kapton).
  2. No foam backing in active region, but the Kapton goes all the way through the beam hole.

The questions we would like to address are:

  1. What is the effect of reducing the material in the inactive area on photon conversions?
  2. What is the effect of reducing the material in the active area on rates on the strips and wires near the beam line?