Minutes-5-15-2008

FDC Weekly Meeting

Date: May 15, 2008

Participants: Daniel, Simon, Brian, Fernando, Roger, Bill, Mark

Next Meeting: May 22, 2008 @ 1:30 p.m.

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Cathode Planning

 - Roger visited Allflex in Minnesota last week and spent the better
   part of a day talking with the company representatives and touring
   the different parts of their facility.  In short, they are very
   excited about the possibility of working with us on the FDC
   cathode project.  Roger was very impressed with the facility and
   the level of cleanliness and professionalism displayed.  He noted
   that Allflex works only with flex circuits and materials.
 - As a result of Roger's meeting with the sales representatives, they 
   came up with a list of questions for us to address when preparing the 
   PR.  Each is listed with the results of the discussion from the
   meeting.
   * What degree of issue are pinholes in the material?  Pinholes can 
     occur when a speck of dust or material is trapped between the 
     photo-resist material and the copper surface during the lamination 
     process.  While every effort is made to ensure that the copper 
     surface is clean, these can/do occasionally occur.
      We feel that given all work is done in a class-100
     clean room, this is the only specification that we need to provide.
     We are satisfied that any pinholes (on a scale of a few mils in size)
     will not affect the cathode performance given that we have reasonably
     with traces.