Difference between revisions of "Minutes-7-28-2011"

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#* Status and plans [http://www.jlab.org/htbin/PHYSICS/halld/enote112.pl?nb=notebook&action=view&page=571 efficiency plot]  
 
#* Status and plans [http://www.jlab.org/htbin/PHYSICS/halld/enote112.pl?nb=notebook&action=view&page=571 efficiency plot]  
 
# Other
 
# Other
 
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= Minutes =
 
= Minutes =
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- Dave (see  the construction tracking): Techs are finishing the cathodes for cell#5 and started working on cell#6 cathodes. The components on wire frame #3 were soldered (except few resistors). Today started tension measurements on wire frame #4.  
 
- Dave (see  the construction tracking): Techs are finishing the cathodes for cell#5 and started working on cell#6 cathodes. The components on wire frame #3 were soldered (except few resistors). Today started tension measurements on wire frame #4.  
  
- Dave: Yesterday we started testing the electroplating. First attempt not successful because of wrong polarity. Following the old prescription resulted in Cu deposition that was too brittle.  
+
- Dave: Yesterday we started testing the electroplating. First attempt not successful because of wrong polarity. Following the old prescription resulted in Cu deposition that was too brittle. Later Bill studied the procedure (see xlsx file attached) and concluded that the current must be much lower and correspondingly the plating time bigger. The last sample using his procedure was shown at the meeting and looked much better. So, thanks to David's micro-controller one can easily change these parameters and improve the procedure. Eugene: what is the QA for this? Bill: looking with high magnification microscope (need price estimate), measuring the diameter with micrometer, may try using the laser sensor and Caleb will look into that, and finally testing with HV.
  
- Waiting for the chemicals for the wire deadening; probably will start testing the procedure beginning of next week. Bill: what is the wire diameter needed to deaden the wire? Lubomir: according to Garfield if we make sense wires 40um signal drops by factor of 40, for 60um - factor of 400, and for 80um -factor of 2,700. After some discussions, Bill will look what is the sagging effect of thickening the wires and Lubomir will estimate the suppression factor that we need.
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- Lubomir studied the leakage currents between the field and sense wires and it turned out it is the new epoxy (Epolite) to be blamed. On an old wire frame short field and sense wires were soldered (11 of each type) on two separate HV boards in the middle of the frame. They were covered with Epolite on one board and with the old epoxy (Epon, used for the prototype) on the other board. After ~24 hours we applied HV and the leakage current between the field and sense wires at the Epolite side was ~40 times higher (~5uA at 500V) than on th Epon side. We found also that the current depends strongly on the humidity. That's why after flushing wire frame #2 with nitrogen for 3 days the current went down from ~7 uA at 2000V to ~500 nA, and this value is still high. Conclusion: we will switch to the old epoxy since there's no time for investigations. Also we will investigate how to "fix" the first four wire frames made already with Epolie, most likely by drying them in a nitrogen box.  
  
- The PR for the iron source was submitted waiting for the RadCon signature, probably at the beginning of the next week.
 
  
- Investigating the sources of the high leakage currents; applied HV on the signal side of a wire frame without wires. In some of the measurements we found the current is too high because of the bad connection between the Cu tape (on which HV is applied) and the wire pads. The lowest current we got is ~10nA for one board when the capacitors are covered with Humiseal, and close to 0nA when capacitors were removed cleaned and then soldered without flux, latter done by Anatoly who put solder on the capacitors and pads, cleaned the flux and then solder the capacitors just by heating. According to Chris this is not a certified way for soldering because of possible oxyde layer.
 
  
- Conclusions for the HV problem: the capacitors itself are not the source of the leakage. Some small amount of flux found below some of the capacitors indicate that this might be a problem but this effect is reduced by covering it with humiseal that actually penetrates also below the capacitors. The humiseal helps also to cover possible sharp places on the capacitor plates that otherwise in gas would produce sparks. Lubomir proposed a procedure for testing the wire frames just before stringing. If all the leakage current of the caps is less than few tens nA the caps will be covered with humiseal, otherwise the caps showing big currents will be removed, the place cleaned and then the caps will be soldered back.
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- Eugene: we can't continue with the wire frame production until it is proven the chamber can hold HV for several weeks. Also, using humiseal is allowed only if it has been used already in drift chambers. If not, we have to do our own tests including irradiation. According to Fernando humiseal has been used in Hall B chambers but outside of the gas volume. Our prototype has a lot of humiseal inside but it has not been tested with radiation. Humiseal is also rated by NASA as low outgassing.
 
  
- We decided first to investigate if there are examples of using humiseal in drift chambers. If not, we will have to do our own tests irradiating the chamber but unfortunately the accelerator is now down. We will look also for other ways to solve the HV problem. For that we will use different wire frames that we have now: some are covered with humiseal, some were cleaned and then soldered without flux.
 
  
 
== Engineering ==
 
== Engineering ==

Revision as of 16:27, 28 July 2011

July 28, 2011 FDC meeting

Agenda

  1. Production Construction Tracking (Dave)
  2. Engineering update (Bill)
  3. Electronics update (Chris)
  4. Chamber testing at EEL126 (Beni)
  5. Other

Minutes

Participants: Eugene, Bill, Dave, Chris, Beni, Simon, Caleb, and Lubomir.

Production

- Dave (see the construction tracking): Techs are finishing the cathodes for cell#5 and started working on cell#6 cathodes. The components on wire frame #3 were soldered (except few resistors). Today started tension measurements on wire frame #4.

- Dave: Yesterday we started testing the electroplating. First attempt not successful because of wrong polarity. Following the old prescription resulted in Cu deposition that was too brittle. Later Bill studied the procedure (see xlsx file attached) and concluded that the current must be much lower and correspondingly the plating time bigger. The last sample using his procedure was shown at the meeting and looked much better. So, thanks to David's micro-controller one can easily change these parameters and improve the procedure. Eugene: what is the QA for this? Bill: looking with high magnification microscope (need price estimate), measuring the diameter with micrometer, may try using the laser sensor and Caleb will look into that, and finally testing with HV.

- Lubomir studied the leakage currents between the field and sense wires and it turned out it is the new epoxy (Epolite) to be blamed. On an old wire frame short field and sense wires were soldered (11 of each type) on two separate HV boards in the middle of the frame. They were covered with Epolite on one board and with the old epoxy (Epon, used for the prototype) on the other board. After ~24 hours we applied HV and the leakage current between the field and sense wires at the Epolite side was ~40 times higher (~5uA at 500V) than on th Epon side. We found also that the current depends strongly on the humidity. That's why after flushing wire frame #2 with nitrogen for 3 days the current went down from ~7 uA at 2000V to ~500 nA, and this value is still high. Conclusion: we will switch to the old epoxy since there's no time for investigations. Also we will investigate how to "fix" the first four wire frames made already with Epolie, most likely by drying them in a nitrogen box.