Difference between revisions of "Minutes-8-16-2012"

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(Cathode corrosion)
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== Conductive tape technology ==
 
== Conductive tape technology ==
 
 
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- Dave: cathode #61 (type-3) that was supposed to be the first for package #2 showed a problem: the Mylar peeled off on the second day after gluing it. The surface is tacky. Bill will consult with the manufacturer of the Hysol epoxy and we will do several experiments to test it. The frame was re-used, Casey sanded it with #220 as he did for the frames that were converted to type-2 from type-1, but using different sanding tool. Tomorrow we will see if the surface will be still tacky and will re-sand it in the same way as for the converted frames.
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- Microscope pictures from the damaged cathodes (package one) on which we have removed the rigid-flex assemblies (or daughter cards) are linked. On the card contacts one can see the silver balls, on the foil contacts the conductive tape is visible with some balls inside and also on the copper pads.   
 
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- We discussed the change/instability of the resistance of the cathode contacts (present for several percents of the total number of channels). We measure the resistances every time we put a cathode in the stack. It is more prominent for the older cathodes and we are not sure if it is a results of some kind of aging, or simply due to more handling and deforming of the cathode frames. Vlad is looking if the bad channels are just statistical fluctuation. Looking with a microscope on the conductive tape he counted that we have ~76 silver balls per pad (2.5x0.5 mm^2), but only ~20 of them are big. Assuming Poisson distribution, in about few percents of the contacts one could expect a resistance that is twice bigger than the mean one. Vlad will do measurements of the resistance of the contacts on one (or more) cathode to see if it can be explained just statistically.
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- Most likely the z-axis conductive tape technology will be a concern for the coming few years, therefore we discussed the conventional way of soldering to the 2micron copper. Anatoly and Casey soldered two connectors successfully, the question is what is the yield. Bill: according to Mark one has to control the heat on the copper very well, he has seen melting the copper. Another important question is, what if for example one has to replace a broken connector on the daughter-card. Unlike with the conductive tape technology, un-soldering the rigid-flex is not possible. Anatoly tried it; the only way one can do it is by cutting the flex channel by channel but then there's a good chance to cut part of the copper traces. Eugene: can we replace the connector while the daughter card is on the cathode. Chris and Dave will try to test if that's possible. Certainly these discussions will continue.
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- Cathode #2 (type-3), one of the first cathodes, showed high resistance on some of the channels in two connectors, in total 8-10 channels, that could not be fixed. We decided to try to fix these channels by soldering a wire between the top of the flex pad and the copper trace just outside of the spacer ring (we have about 3mm trace there), as Anatoly suggested. Anatoly and Chris will give it a try.
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- We decided to continue with the above tests and postpone for one more week the installation of the second package. We are flushing the third and the fourth packages (in parallel) with nitrogen since last Friday when we got a dewar.   
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== Engineering ==
 
== Engineering ==
  

Revision as of 12:25, 17 August 2012

August 16, 2012 FDC meeting

Agenda

  1. Cathode production Construction Tracking (Dave)
  2. Cathode corrosion
    • Status [1]
    • Possible procedure changes
  3. Conductive tape technology
  4. Engineering (Bill)
    • Cathode strong-back
    • Other: epoxy tests
  5. Electronics (Chris, Nick)
    • PCBs
  6. TDR, pages 132-145 (Lubomir)
  7. Other


Minutes

Participants: Eugene, Bill, Dave, Simon, Vlad, Beni, and Lubomir

Cathode production

- Dave: working on 8 new cathodes to be used in the second package. The bottleneck is the card gluing since we have not decided if we want to change the procedures.

Cathode corrosion

- Lubomir about the SEM results: On the wire samples some small crystals (~3um) are seen containing sulfur, Olga counted about 25 of these on 2cm wire length; too small quantity to account for the copper damage on the cathodes. On the EPDM surface - no conductivity and very low yield from the microscope - still one sees some sulfur on the used EPDM, and much less or nothing on the virgin EPDM and on the prototype EPDM. Dave will check if the virgin and used EPDMs are from the same batch.

- Results from the vacuum chamber (Vlad's) experiment: it was running from last Thursday (end of the day) till Monday morning, pictures linked above. One clearly sees damages on the EPDM sample, just a little on the Viton one and no damages are seen on the Viton+grease sample. The samples are now with Olga and will have SEM results next week. Bill proposed to make another sample with Viton+grease with curving shape to have more potentially damaged area and then measure if the resistance has changed. Vlad will check the resistance of the samples that we have now. On Tuesday we started the same test except there's no water inside the gas volume.

- As of now we see two solutions of the corrosion problem: using the technology that we used already for the third and fourth packages, i.e. Viton+grease, or in addition to that, covering big areas on the cathode including all the traces with Kapton glued with Hysol. Using Kapton foils doesn't seem to create leakage but we tested this on a flat Lexan sheet. We decided to use the standard technology for the second package, i.e. only Viton+grease. When we come to the first package (in about two-three month from now) we will discuss again the use of Kapton; there we may have to use it if we are going to re-use the cathodes from the former second package since some of the channels have to be fixed with conductive ink. Of course we will wait for the latest SEM results before continuing with this procedure.

Conductive tape technology