Aug 11, 2011 SiPM Electrical and Cooling

Action Items from previous meetings

1. Add hardware voltage limits to bias circuit (Jack)
2. Reset devices when communication errors are encountered in control loop (Yi)
3. Send Jim the dxf file of the U board with the new capacitors to check mechanical fit. (Chris)
4. Hood in EEL 126 is being removed (Jack will check on status)
5. Investigate whether there is sufficient room to add an additional layer to the electronics at the inside of the Bcal (Fernando).

Tentative Agenda

1. Announcements
2. Action Items
3. Schedule, reporting, and manpower (Elton)
4. SiPM testing (Carl and Yi)
5. Mechanical (Jim)
6. Mechanical drawings (Chuck)
7. Geometry (Elton)
8. Temperature compensation (Jack)
9. Preamp-summing (Fernando)
10. Granularity (Elton)

Minutes

Attending: Jack, Fernando, Chris, Jim, Elton.

1. Announcements
2. Action Items
   • No progress. Next week.
3. Schedule, reporting, and manpower (Elton)
4. SiPM testing (Carl and Yi)
   • Carl on vacation and Yi is working on solenoid
5. Mechanical (Jim)
   • Modified cooling plate to fit the updated U board. Adjusted threshold holes for stand offs. Redid layout to accommodate supports for electronics. Laid in RTDs.
   • Sent dxf file of SiPM production testing to Fernando to use as template.
   • Elton and Jim will review sizes and locations of monitoring control board for compatibility (this was done immediately following the meeting).
6. Mechanical drawings (Chuck)
   • Jim will leave Chuck the latest model and discuss what drawings he can start on, which are not expected to change due to a possible change of number of layers.
   • Chuck will start making the drawings that are ready.
7. Geometry (Elton)
8. Temperature compensation (Jack)
   • Bias testing has been setup with dry ice to cool and dry the overall environment.
   • Test setup is in good shape and the dry ice works well.
   • Yi is concerned about gradients through the sensor and will implement various tests to check this. He has also suggested to use the same devices to measure temperature.
   • Test a statistical sample for accuracy of temperature sensors to check against data sheets.
   • Expect to use the setup to power a device this week.
   • Jim: suggests to ask the company to provide the statistical data, at least for the large number of sensors that we might need.
9. Preamp-summing (Fernando)
   • Test of SiPM have been updated in the GlueX-doc
   • Tests were done using 70 ps width pulse laser.
   • Layout of main board is essentially complete for the 3-3-4 configuration.
   • Chris has modified the U board to be able to accommodate the new capacitors. The files was sent to Jim.
   • Electronics for SiPM production testing will be laid out according to file prepared by Jim. Cabling will be modified from current single cell design by changing cable connections.
10. Granularity (Elton)