Jan 26, 2011 SiPM Electrical and Cooling

Action Items from previous meetings

1. Populate interface cards to the ADC (Chris)
2. Complete 3 remaining boards for SiPM testing (Chris)

Tentative Agenda

1. Announcements
2. Action Items
3. Schedule, reporting, and manpower (Elton)
4. SiPM production testing (everyone)
5. Mechanical assembly (Scot)
6. Mechanical (Jim)
7. Mechanical drawings (Chuck)
8. Temperature compensation (Jack)
9. Preamp-summing (Fernando/Chris)
10. SiPM testing (Ivan)

Minutes

Attending: Carl, Jack, Scot, Chris, Ivan, Yi, Jim, Howard Fenker, John, Elton, Eugene.

1. Announcements
2. Action Items
3. Schedule, reporting, and manpower (Elton)
   • Updated reporting sheet
   • At the end of the meeting Elton showed an overall schedule for assembly and installation of the Bcal.
4. SiPM production testing (everyone)
   1. Test Setup (Carl)
      • Upon connecting board to bias discovered that the bias pins were swapped.
      • Took a look at one SiPM operating at normal voltage/current
      • Transition board from samtek/ADC does not snap the locking latch.
   2. Readout (Yi)
      • Basic interface is operational
      • Only required input is the SiPM serial number.
      • System automatically downloads the Hamamatsu operating voltage.
      • Eugene: Allow an input offset voltage which can be added to all SiPMs. Could be useful when performing a voltage scan.
   3. Personnel
      • Eugene will inquire about students to do routine testing once the test setup is ready.
5. Mechanical assembly (Scot)
   • Scot has performed several gluing tests. The latest with prototype light guides from Plastic Craft.
   • The guides show crazing at the base, where they were glued, and also on two sides, which received minimal glue if any during the test.
   • It was noted that some of the glue samples had not cured completely. The material is not UVT, so the light source may not have penetrated the guide material and kept the glue from curing.
   • Further tests are needed to determine if the cause is the glue, the guide material, light source, or some aspect of the procedure.
6. Mechanical (Jim)
7. Mechanical drawings (Chuck)
8. Temperature compensation (Jack)
   • U-board fixture plate has been redesigned and will be ordered.
   • Has modified pieces for gluing fixture to assist with holding light guides.
9. Preamp-summing (Fernando/Chris)
   • Fernando has checked the new drawings for the wedge electronic boards and they will be sent out for fabrication tomorrow.
   • Fernando has also checked the drawings for the SiPM compact design and they will also be sent out tomorrow.
10. SiPM testing (Ivan)
    • Waiting on resolution of laser operation procedure.