July 26, 2011 SiPM Electrical and Cooling

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Action Items from previous meetings

  1. Develop front and back views of jumper sheets. (Jack)
  2. Check into AC units based on Peltier coolers for SiPM production tests (Fernando) See SRCOOL12K and MovinCool
  3. Review Fcal LED and controller monitoring boards (Fernando)
  4. Decide on size of overlap of voltage bins for the SiPMs (Yi and Jack)
  5. Complete molds for wrapping and order forms (Jim) Elton to test wrapping forms.
  6. Thermal mats need to be ordered (Jim said that Fernando or Chris will take care of this)
  7. Cooling tubes need to be brazed in (Jim?) Bending and brazing tubes in progress
  8. Circuit board and micro-Dsub connector for monitoring system needs to be completed (Chris and Jim)

Tentative Agenda

  1. Announcements
  2. Action Items
  3. Schedule, reporting, and manpower (Elton)
  4. SiPM production testing (everyone)
    • SiPMs assignment for new boards
  5. Mechanical assembly (Jim)
  6. Temperature compensation (Jack)
  7. Electronic boards (Chris)
  8. Light guide gluing setup

Minutes

Attending: Elton, Fernando, Yi, Chris, Nick, Scot

  1. Announcements
  2. Action Items
  3. Schedule, reporting, and manpower (Elton)
    • Light guide schedule: Two sets are promised for shipping tomorrow. Once in production, USM expects to be able to produce many sets per week.
  4. SiPM production testing (Yi)
    1. Ben St.Laurent has been analyzing the data that Bobby took
      • All SiPMs are good except for one outlier
      • The 3rd cooling plate was very noisy. It was possible to remove the systematic noise using the average over all tests.
      • Comparison with the Hamamatsu gives confidence in the test data from Hamamatsu.
      • Sixteen units with low PDE were found, but all measured in one batch. It is likely the testing had a problem and will be retested.
      • Data taken on cross talk and afterpulsing, but it has not yet been analyzed
      • Optimal bias voltage setting has been revisited. Original conclusions that showed a minimum at an overbias of 1.15 V was faulty. The corrected calculations show a slow improvement with voltage up to 2 V. The suggestion is to keep the setting at an overbias of 1.2 V
    2. SiPMs assignment for new boards
      • Shaun Krueger has been working on algorithms to assign SiPMs to wedge boards, including the required jumper settings.
  5. Mechanical assembly (Jim)
    • James Wagner has completed all the component drawings, but they are not yet completely checked or signed off. They should be ready next week
    • Assembly drawings have not been done and we still need to decide how many are needed. A least the top-level drawing is required.
  6. Temperature compensation (Jack)
  7. Electronic boards (Chris)
    • All boards and supplies are in
    • The populated Wedge board have been received and a testing is planned for next week
    • The 86k 0.1% resistors have been received. These will be substituted onto the boards.
    • The spare board will be updated to match the mini-Bcal boards including new gains for fADC and TDC outputs
    • A direct comparison of the new pre-production boards and the spare board will be done, before any further optimization.
  8. Light guide gluing setup
    • Tent for gluing has been completed and is in the ESB
    • New gluing fixture parts are in. Jim will give Scot the parts for assembly and checkout
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