Jun 9, 2011 SiPM Electrical and Cooling

Action Items from previous meetings

1. Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories.
2. Jim will order the mechanical cover so that the Lemo connections can be checked for rigidity
3. Jim to send information about larger cables which could be used for connections between the U-board and the preamp.

Tentative Agenda

1. Announcements
2. Action Items
3. Schedule, reporting, and manpower (Elton)
4. SiPM testing (Carl and Yi)
5. Mechanical (Jim)
6. Mechanical drawings (Chuck)
7. Geometry (Elton)
8. Temperature compensation (Jack)
9. Preamp-summing (Fernando)

Minutes

Attending: Elton, Chris, Chuck, Jim, Ivan, Yi, Jack, Carl

1. Announcements
2. Action Items
3. Schedule, reporting, and manpower (Elton)
   • Updated progress on bias check
4. SiPM testing (Carl)
   • Cleaning out EEL building, added VME crate, will order USB controller, PC
   • Have 4 QDCs, need 4 more
   • Discussion on cabling to electronics, for connecting 16-channel readout of 16 sensors to the QDCs
   • Various cabling options discussed. The default is 256 coax cables with a translator board from Lemo to 34pin headers
   • Fernando will check son SEMTEC cable assemblies.
5. SiPM (Yi and Ivan)
   • Working on temperature control box
   • program completed with cooling device and talked to other devices
   • Ivan will write a program to integrate parts (Labview)
6. Mechanical (Jim)
   • Mechanical model completely updated with new dimensions from Elton.
   • Updates to take into account manufacturability
   • This model will be provided to Chuck for input into IDeas
   • Added adjustments to cover connections to compensate for as-built Bcal modules.
7. Mechanical drawings (Chuck)
   • Drawings with updated dimensions for one light guide have been produced. Jim, Chuck and Elton will review the drawing after the meeting.
8. Geometry (Elton)
   • Modeled several light guide configurations
   • Main study looked at the acceptance as a function of the output face size. Finds that the maximum acceptance occurs at height=13.2 mm (compare to the size of the SiPM of 12.7 mm)
   • No dependence of acceptance on light guide length
   • GlueX-doc note in progress.
9. Temperature compensation (Jack)
   • Students working on mechanical arrangement and will work with Ivan on integrating the test setup
   • Will initially use unpopulated board, but will obtain a populated board from Chris for further electronic tests
   • Need to use a stable bias supply. (The one on order will not be available till end of July, although a loaner might be)
10. Preamp-summing (Fernando)
    • Sensor response located next to preamp gives rise time of about 10 ns
    • With 4" cables rise time is about 24 ns.
    • Cutting cables by half reduces rise time to about 17 ns.
    • New (thicker) cables on order should reduce the rise time further
    • Will check rise time with new cables on order.