June 21, 2011 SiPM Electrical and Cooling

From GlueXWiki
Jump to: navigation, search

Action Items from previous meetings

  1. Develop front and back views of jumper sheets. Also get latest version of drawings (Jack)
  2. Check into AC units based on Peltier coolers for SiPM production tests (Fernando)
  3. Design tooling/procedure for making the patterns for wrapping from tedlar (Jim)
  4. Review Fcal LED and controller monitoring boards (Fernando)

Tentative Agenda

  1. Announcements
  2. Action Items
  3. Schedule, reporting, and manpower (Elton)
  4. Beam test experience (Elton)
  5. SiPM production testing (everyone)
  6. Mechanical assembly (Scot)
  7. Mechanical (Jim)
  8. Mechanical drawings (Chuck)
  9. Temperature compensation (Jack)
  10. Preamp-summing (Chris)
  11. Light guide gluing setup


Minutes

Attending: Jack, Nick, Yi, Elton, Chris, Jim, Eugene

  1. Announcements
  2. Action Items
  3. Schedule, reporting, and manpower (Elton)
  4. Beam test experience (Elton)
  5. SiPM production testing (Yi)
    • Bobby has completed the testing of all SiPMs on hand.
    • A summer student (Ben) is learning how to process the data.
    • Optimal bias for operation is Vover=1.15 V, but depends on assumptions regarding cross talk. Will take data to extract this information more accurate and revisit the optimum
    • Elton: Serguei Kuleshov is also checking the optimum point at USM and should report next week
  6. Mechanical assembly (Scot)
  7. Mechanical (Jim)
    • Obtained patters for light guide wrapping. Will investigate trade-offs for various fabrication scenarios
    • Joseph has completed the drawings for the test setup and parts should be here next week. He will put the setup together and have wooden sides made to extend the depth.
    • The final model has been given to Chuck to produce drawings.
    • All mechanical pieces are in for the 2-piece build
    • Hardware should be ordered by the end of the week.
    • All mechanical pieces and hardware will be ordered once the 2-piece build is checked.
  8. Mechanical drawings (Chuck)
  9. Temperature compensation (Jack)
    • Operational points for latest batch of SiPMs did not change the distribution.
    • Elton: USM expects all SiPMs to be delivered by mid July. The Hamamatsu data can then be used to obtain final values for the trim resistors.
    • Yi: At the moment the voltage bins are non-overlapping, making it more difficult to fit all SiPMs into appropriate bins. Suggested that the bins be widened to overlap by about 20% (this should be checked)
  10. Preamp-summing (Chris)
    1. Parts for the 2-piece build
      • Thermistor boards completed
      • Mechanical pieces in house
      • Wedge boards in house; ready to go out as soon as quotes come in
      • U-boards almost complete
      • HFL cables coming in.
    2. Parts for production
      • U-boards have been ordered
      • 2" UFL cables are coming in
      • 100 transition boards are out for award
  11. Light guide gluing setup
Retrieved from "https://halldweb.jlab.org/wiki/index.php?title=June_21,_2011_SiPM_Electrical_and_Cooling&oldid=37838"