May 12, 2011 SiPM Electrical and Cooling

From GlueXWiki
Jump to: navigation, search

References

Action Items from previous meetings

  1. Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories.
  2. Check bowing with FEA
  3. PCB dummy power load for thermal test.

Tentative Agenda

  1. Announcements
  2. Action Items
  3. Schedule, reporting, and manpower (Elton)
  4. SiPM testing (Carl and Yi)
  5. Mechanical (Jim)
  6. Mechanical drawings (Chuck)
  7. Geometry (Elton)
  8. Temperature compensation (Jack)
  9. Preamp-summing (Fernando)

Minutes

Attending: Chuck, Jim, Elton, Carl, Jack, Yi, Chris

  1. Announcements
    • No meeting next week.
  2. Action Items
  3. Schedule, reporting, and manpower (Elton)
    • No updates to schedule
  4. SiPM testing (Carl and Yi)
    • Carl has received comments to draft report. Will incorporate with figures from Yi and send to Thomas Bailey tomorrow afternoon in time for his trip to Japan.
    • Ten samples each for Regina and USM have been remeasured. Minor discrepancies were discovered compared to previous measurements, but these can be explained due to incomplete warm up.
    • Given the data, the HV can be tuned on the samples to achieve better matching.
  5. Mechanical (Jim)
    • Considerable discussion on tolerances and datum for the sensors.
    • Eugene suggested a new idea of adding a (permanent) block to the bottom of the SiPM, which would be used to reference the sensor. This could be screwed into the cooling plate
    • Jim with Carl's help will measure the sensor packages with an eye toward actual tolerances, and consider the use of the cooling plate as the datum.
    • Light guide molds: Rough estimate for the 40 guide glass mold could be about $30k. Jim will talk to engineer and find out if we can get examples of molds to check surface quality. Likely the molds would be made for only a tower at a time (i.e. 10 guides)
  6. Mechanical drawings (Chuck)
  7. Geometry (Elton)
  8. Temperature compensation (Jack)
    • Prototype boards (3 amps, one sum and bias compensation circuit) have been made. One has been populated. Minor changes are required, but can be accommodated for the tests.
    • Thermal test box should be completed by the end of the month.
  9. Preamp-summing (Fernando)
Retrieved from "https://halldweb.jlab.org/wiki/index.php?title=May_12,_2011_SiPM_Electrical_and_Cooling&oldid=27204"