May 24, 2011 SiPM Electrical and Cooling

Action Items from previous meetings

1. Determine if swapped bias pins was accidental or in design (Chris)
2. Develop front and back views of jumper sheets. Also get latest version of drawings (Jack)
3. Check into AC units based on Peltier coolers for SiPM production tests (Fernando)
4. Order and assemble a third SiPM puller as a backup for JLab (Jim and Scot)
5. Design tooling/procedure for making the patterns for wrapping from tedlar (Jim)
6. Review Fcal LED and controller monitoring boards (Fernando)

Tentative Agenda

1. Announcements
2. Action Items
3. Schedule, reporting, and manpower (Elton)
4. Beam test experience (Elton)
5. SiPM production testing (everyone)
6. Mechanical assembly (Scot)
7. Mechanical (Jim)
8. Mechanical drawings (Chuck)
9. Temperature compensation (Jack)
10. Preamp-summing (Chris)
11. Light guide gluing setup
    • Wrapping for light guides

Minutes

Attending: Fernando, Nick, Chris, Jim, John, Elton.

1. Announcements
2. Action Items
3. Schedule, reporting, and manpower (Elton)
   • Delivery of first 17 sets of light guides is scheduled for July 2.
   • Monitoring boards will not be available then. Need to determine for procedure for adding them after gluing.
   • Elton, Tom and Walt will visit the ESB and come up with a plan for the location for testing Bcal modules.
4. SiPM production testing (everyone)
5. Mechanical (Jim)
   1. Entire model for readout is complete and passed on to Chuck. A small change includes a change to the inner wall pieces
      • Two full sets for readout are being collected and already may be in house. Once complete, the items can be taken to be anodized.
   2. The glue for the cooling pipe and the RTDs needs to be reevaluated and ordered.
   3. Small hardware parts still need to be ordered.
   4. Molds for the light covers still need to be made. The estimate is that the original mold needs to be reduced in length by about 3 mm.
   5. At a future controls meeting, we need to present our plans for RTDs, humidity sensors, and chiller
6. Preamp-summing (Fernando and Chris)
   1. Procurement of parts is ongoing
      • transition board is on a 5 day turn. parts will be ordered tomorrow
      • Thermistor board has been updated with additional holes and will be ordered tomorrow
      • Readout board changes are under review and parts ordered
      • U-board quotes for turn-key assembly are coming in high. Clarifications in progress. Might consider ordering parts, boards and assembly as separate orders. A total of 4000 production boards are on order. We decided to get 80 additional U-board to be able to assemble two new readout packages independent of the ones currently on the mini-Bcal. [The additional 80 may be part of the larger board order or separate].
   2. Decisions to be made are
      • Two types of boards (U and D) with different bias routing for inner layers. We decided we should have two board types and order one of each now for testing this summer
      • Dynamic range. Elton, Fernando and UofR will meet tomorrow afternoon to discuss how to move forward
      • TDC amplification. Nominal value now is x5 and should not go lower.
   3. Nominal values will be specified now for the build. However, changes to the gain can be easily made after the board is assembled.