May 26, 2011 SiPM Electrical and Cooling

Action Items from previous meetings

1. Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories.
2. PCB dummy power load for thermal test.

Tentative Agenda

1. Announcements
2. Action Items
3. Schedule, reporting, and manpower (Elton)
4. SiPM testing (Carl and Yi)
5. Mechanical (Jim)
6. Mechanical drawings (Chuck)
7. Geometry (Elton)
8. Temperature compensation (Jack)
9. Preamp-summing (Fernando)

Minutes

Attending: Yi, Ivan, Chris, Tim, Jim, Eugene, Elton

1. Announcements
2. Action Items
   • Progress on electronic prototypes, but no updates to EVMS
3. Schedule, reporting, and manpower (Elton)
4. SiPM testing (Carl and Yi)
   • Ivan and Yi measured the response of the SiPM to a standard source in the magnetic field of Coil 3. The preamp electronics was also in the field. No measurable differences were found up to the maximum field measured of 0.5 T. This result is not unexpected, but gives confirmation that we can safely operate the units and electronics in a 0.5 T field. The expected magnetic field at the end of the Bcal is about this value.
5. Mechanical (Jim)
   • Estimate of the cost of the mechanical system for 100 units is about 2.5 times the current budget.
   • Jim measured 30 SiPM units. Uniformity was within 0.2 mils for the thickness, well within expected tolerances.
   • Showed the new layout of all components
6. Mechanical drawings (Chuck)
   • Chuck will start on the drawings for the light guides tomorrow.
7. Geometry (Elton)
8. Temperature compensation (Jack)
9. Preamp-summing (Fernando)
   • Was not present, but has started testing the prototype circuit.
   • Chris has started ordering parts for the heat source for the mechanical thermal test.