Sep 20, 2011 SiPM Electrical and Cooling

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Action Items from previous meetings

  1. Decide on cable connections for monitoring cable from Bcal wedge to patch panel. Consider electronics needed for pulsing system (Elton and Fernando)
  2. Get the dosage from the radiation badges on the mini-Bcal during the beam test (Yi) The doses have been obtained from RadCon and Yi estimates that the dark rate of the SiPMs should be slightly increased.
  3. Work with Shaun to write up a procedure for substituting a sensor on one of the boards to be assembled. (Jack)

Tentative Agenda

  1. Announcements
  2. Action Items
  3. Schedule, reporting, and manpower (Elton)
  4. mini-Bcal (Elton)
    • GlueX-doc-2053 Tests of the pre-production readout assemblies with the mini-Bcal
  5. SiPM production testing (Yi)
  6. Mechanical assembly (Jim)
  7. Temperature compensation (Jack)
  8. Electronic boards (Fernando and Chris)
  9. Light guide gluing setup (Scot)

Minutes

Attending: Chris, Nick, Yi, Eugene, Jim, Ivan, Fernando, Elton.

  1. Announcements
  2. Action Items
  3. Schedule, reporting, and manpower (Elton)
    • Third shipment (520 pieces) from USM arrived.
  4. mini-Bcal (Elton)
    • GlueX-doc-2053 Tests of the pre-production readout assemblies with the mini-Bcal
    • Elton summarized findings of measurements on the mini-Bcal.
    • Fernando mentioned that that his measurements were using an electronic pulser and no sensor.
    • Eugene: Asked about the procedure for testing the SiPMs after the assembly was put together. The process now checks that each SiPM is alive and responsive to a standard light source. We should also record the response of each signal response to the LED. The uniformity of the light source in the dark box will be checked and a diffuser will be installed to even out any non-uniformities in the illumination of the SiPMs.
  5. SiPM production testing (Yi)
    • The shipment contained a disk with a dump of the SiPM data base, which has now been uploaded to mysql.
    • The replacement for the SiPM that was out of specifications has arrived.
    • The doses have been obtained from RadCon and Yi estimates that the dark rate of the SiPMs should be slightly increased. The SiPMs from the beam test should be retested to check the damage.
  6. Mechanical assembly (Jim)
    • Chuck and James are now back.
    • James has produced all component drawings and Chuck has checked them. Jim will review and approve them next week.
    • All PRs and purchases can be made based on these drawings.
    • Sub-assembly and assembly drawings will follow.
    • Fernando: Suggested either engraving or creating a silk screen to add channel numbers for the outputs on the face of the assembly. Jim prefers the silk screen solution, that way the parts are the same for upstream and downstream. The printed labels will be different.
    • Nick: Make a metal die to punch holes in cooling mat to ease assembly.
    • Nick has a PR for the thermal mats. Eugene said to go ahead and submit it.
    • Chris; Downstream schematics have been changed, gerber file created and the BOM file almost done. Will ready the PR and then update the files for the upstream side.
  7. Temperature compensation (Jack)
  8. Electronic boards (Fernando and Chris)
    • Fernando has sent out a schedule detailing assembly. Jim and Elton need to review and provide feedback.
    • There are some mechanical assembly steps required to prepare parts for the assembly: bend the cooling pipes, braze fittings, glue onto cooling plate; add thermistor boards and RTDs; prepare mounting studs.
  9. Light guide gluing setup (Scot)