Difference between revisions of "Aug 11, 2011 SiPM Electrical and Cooling"
From GlueXWiki
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# Announcements | # Announcements | ||
# Action Items | # Action Items | ||
+ | #* No progress. Next week. | ||
# Schedule, reporting, and manpower (Elton) | # Schedule, reporting, and manpower (Elton) | ||
# SiPM testing (Carl and Yi) | # SiPM testing (Carl and Yi) | ||
+ | #* Carl on vacation and Yi is working on solenoid | ||
# Mechanical (Jim) | # Mechanical (Jim) | ||
+ | #* Modified cooling plate to fit the updated U board. Adjusted threshold holes for stand offs. Redid layout to accommodate supports for electronics. Laid in RTDs. | ||
+ | #* Sent dxf file of SiPM production testing to Fernando to use as template. | ||
+ | #* Elton and Jim will review sizes and locations of monitoring control board for compatibility (this was done immediately following the meeting). | ||
# Mechanical drawings (Chuck) | # Mechanical drawings (Chuck) | ||
+ | #* Jim will leave Chuck the latest model and discuss what drawings he can start on, which are not expected to change due to a possible change of number of layers. | ||
+ | #* Chuck will start making the drawings that are ready. | ||
# Geometry (Elton) | # Geometry (Elton) | ||
# Temperature compensation (Jack) | # Temperature compensation (Jack) | ||
+ | #* Bias testing has been setup with dry ice to cool and dry the overall environment. | ||
+ | #* Test setup is in good shape and the dry ice works well. | ||
+ | #* Yi is concerned about gradients through the sensor and will implement various tests to check this. He has also suggested to use the same devices to measure temperature. | ||
+ | #* Test a statistical sample for accuracy of temperature sensors to check against data sheets. | ||
+ | #* Expect to use the setup to power a device this week. | ||
+ | #* Jim: suggests to ask the company to provide the statistical data, at least for the large number of sensors that we might need. | ||
# Preamp-summing (Fernando) | # Preamp-summing (Fernando) | ||
+ | #* Test of SiPM have been updated in the GlueX-doc | ||
+ | #* Tests were done using 70 ps width pulse laser. | ||
+ | #* Layout of main board is essentially complete for the 3-3-4 configuration. | ||
+ | #* Chris has modified the U board to be able to accommodate the new capacitors. The files was sent to Jim. | ||
+ | #* Electronics for SiPM production testing will be laid out according to file prepared by Jim. Cabling will be modified from current single cell design by changing cable connections. | ||
# Granularity (Elton) | # Granularity (Elton) |
Latest revision as of 14:13, 12 August 2011
Action Items from previous meetings
- Add hardware voltage limits to bias circuit (Jack)
-
Reset devices when communication errors are encountered in control loop (Yi) -
Send Jim the dxf file of the U board with the new capacitors to check mechanical fit. (Chris) -
Hood in EEL 126 is being removed (Jack will check on status) - Investigate whether there is sufficient room to add an additional layer to the electronics at the inside of the Bcal (Fernando).
Tentative Agenda
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- SiPM testing (Carl and Yi)
- Mechanical (Jim)
- Mechanical drawings (Chuck)
- Geometry (Elton)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
- Granularity (Elton)
Minutes
Attending: Jack, Fernando, Chris, Jim, Elton.
- Announcements
- Action Items
- No progress. Next week.
- Schedule, reporting, and manpower (Elton)
- SiPM testing (Carl and Yi)
- Carl on vacation and Yi is working on solenoid
- Mechanical (Jim)
- Modified cooling plate to fit the updated U board. Adjusted threshold holes for stand offs. Redid layout to accommodate supports for electronics. Laid in RTDs.
- Sent dxf file of SiPM production testing to Fernando to use as template.
- Elton and Jim will review sizes and locations of monitoring control board for compatibility (this was done immediately following the meeting).
- Mechanical drawings (Chuck)
- Jim will leave Chuck the latest model and discuss what drawings he can start on, which are not expected to change due to a possible change of number of layers.
- Chuck will start making the drawings that are ready.
- Geometry (Elton)
- Temperature compensation (Jack)
- Bias testing has been setup with dry ice to cool and dry the overall environment.
- Test setup is in good shape and the dry ice works well.
- Yi is concerned about gradients through the sensor and will implement various tests to check this. He has also suggested to use the same devices to measure temperature.
- Test a statistical sample for accuracy of temperature sensors to check against data sheets.
- Expect to use the setup to power a device this week.
- Jim: suggests to ask the company to provide the statistical data, at least for the large number of sensors that we might need.
- Preamp-summing (Fernando)
- Test of SiPM have been updated in the GlueX-doc
- Tests were done using 70 ps width pulse laser.
- Layout of main board is essentially complete for the 3-3-4 configuration.
- Chris has modified the U board to be able to accommodate the new capacitors. The files was sent to Jim.
- Electronics for SiPM production testing will be laid out according to file prepared by Jim. Cabling will be modified from current single cell design by changing cable connections.
- Granularity (Elton)