Difference between revisions of "Aug 11, 2011 SiPM Electrical and Cooling"
From GlueXWiki
(→Action Items from previous meetings) |
(→Tentative Agenda) |
||
| Line 18: | Line 18: | ||
# Temperature compensation (Jack) | # Temperature compensation (Jack) | ||
# Preamp-summing (Fernando) | # Preamp-summing (Fernando) | ||
| + | # Granularity (Elton) | ||
== Minutes == | == Minutes == | ||
''Attending: | ''Attending: | ||
Revision as of 17:04, 4 August 2011
Action Items from previous meetings
- Add hardware voltage limits to bias circuit (Jack)
- Reset devices when communication errors are encountered in control loop (Yi)
- Send Jim the dxf file of the U board with the new capacitors to check mechanical fit. (Chris)
- Hood in EEL 126 is being removed (Jack will check on status)
- Investigate whether there is sufficient room to add an additional layer to the electronics at the inside of the Bcal (Fernando).
Tentative Agenda
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- SiPM testing (Carl and Yi)
- Mechanical (Jim)
- Mechanical drawings (Chuck)
- Geometry (Elton)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
- Granularity (Elton)
Minutes
Attending:
