Difference between revisions of "Jun 9, 2011 SiPM Electrical and Cooling"
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# Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories. | # Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories. | ||
+ | # <strike> Jim will order the mechanical cover so that the Lemo connections can be checked for rigidity </strike> | ||
+ | # <strike> Jim to send information about larger cables which could be used for connections between the U-board and the preamp. </strike> | ||
== Tentative Agenda == | == Tentative Agenda == | ||
Line 18: | Line 20: | ||
== Minutes == | == Minutes == | ||
− | ''Attending: | + | ''Attending: Elton, Chris, Chuck, Jim, Ivan, Yi, Jack, Carl |
+ | |||
+ | # Announcements | ||
+ | # Action Items | ||
+ | # Schedule, reporting, and manpower (Elton) | ||
+ | #* Updated progress on bias check | ||
+ | # SiPM testing (Carl) | ||
+ | #* Cleaning out EEL building, added VME crate, will order USB controller, PC | ||
+ | #* Have 4 QDCs, need 4 more | ||
+ | #* Discussion on cabling to electronics, for connecting 16-channel readout of 16 sensors to the QDCs | ||
+ | #* Various cabling options discussed. The default is 256 coax cables with a translator board from Lemo to 34pin headers | ||
+ | #* Fernando will check son SEMTEC cable assemblies. | ||
+ | # SiPM (Yi and Ivan) | ||
+ | #* Working on temperature control box | ||
+ | #* program completed with cooling device and talked to other devices | ||
+ | #* Ivan will write a program to integrate parts (Labview) | ||
+ | # Mechanical (Jim) | ||
+ | #* Mechanical model completely updated with new dimensions from Elton. | ||
+ | #* Updates to take into account manufacturability | ||
+ | #* This model will be provided to Chuck for input into IDeas | ||
+ | #* Added adjustments to cover connections to compensate for as-built Bcal modules. | ||
+ | # Mechanical drawings (Chuck) | ||
+ | #* Drawings with updated dimensions for one light guide have been produced. Jim, Chuck and Elton will review the drawing after the meeting. | ||
+ | # Geometry (Elton) | ||
+ | #* Modeled several light guide configurations | ||
+ | #* Main study looked at the acceptance as a function of the output face size. Finds that the maximum acceptance occurs at height=13.2 mm (compare to the size of the SiPM of 12.7 mm) | ||
+ | #* No dependence of acceptance on light guide length | ||
+ | #* GlueX-doc note in progress. | ||
+ | # Temperature compensation (Jack) | ||
+ | #* Students working on mechanical arrangement and will work with Ivan on integrating the test setup | ||
+ | #* Will initially use unpopulated board, but will obtain a populated board from Chris for further electronic tests | ||
+ | #* Need to use a stable bias supply. (The one on order will not be available till end of July, although a loaner might be) | ||
+ | # Preamp-summing (Fernando) | ||
+ | #* Sensor response located next to preamp gives rise time of about 10 ns | ||
+ | #* With 4" cables rise time is about 24 ns. | ||
+ | #* Cutting cables by half reduces rise time to about 17 ns. | ||
+ | #* New (thicker) cables on order should reduce the rise time further | ||
+ | #* Will check rise time with new cables on order. |
Latest revision as of 18:27, 9 June 2011
References
Action Items from previous meetings
- Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories.
-
Jim will order the mechanical cover so that the Lemo connections can be checked for rigidity -
Jim to send information about larger cables which could be used for connections between the U-board and the preamp.
Tentative Agenda
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- SiPM testing (Carl and Yi)
- Mechanical (Jim)
- Mechanical drawings (Chuck)
- Geometry (Elton)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
Minutes
Attending: Elton, Chris, Chuck, Jim, Ivan, Yi, Jack, Carl
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- Updated progress on bias check
- SiPM testing (Carl)
- Cleaning out EEL building, added VME crate, will order USB controller, PC
- Have 4 QDCs, need 4 more
- Discussion on cabling to electronics, for connecting 16-channel readout of 16 sensors to the QDCs
- Various cabling options discussed. The default is 256 coax cables with a translator board from Lemo to 34pin headers
- Fernando will check son SEMTEC cable assemblies.
- SiPM (Yi and Ivan)
- Working on temperature control box
- program completed with cooling device and talked to other devices
- Ivan will write a program to integrate parts (Labview)
- Mechanical (Jim)
- Mechanical model completely updated with new dimensions from Elton.
- Updates to take into account manufacturability
- This model will be provided to Chuck for input into IDeas
- Added adjustments to cover connections to compensate for as-built Bcal modules.
- Mechanical drawings (Chuck)
- Drawings with updated dimensions for one light guide have been produced. Jim, Chuck and Elton will review the drawing after the meeting.
- Geometry (Elton)
- Modeled several light guide configurations
- Main study looked at the acceptance as a function of the output face size. Finds that the maximum acceptance occurs at height=13.2 mm (compare to the size of the SiPM of 12.7 mm)
- No dependence of acceptance on light guide length
- GlueX-doc note in progress.
- Temperature compensation (Jack)
- Students working on mechanical arrangement and will work with Ivan on integrating the test setup
- Will initially use unpopulated board, but will obtain a populated board from Chris for further electronic tests
- Need to use a stable bias supply. (The one on order will not be available till end of July, although a loaner might be)
- Preamp-summing (Fernando)
- Sensor response located next to preamp gives rise time of about 10 ns
- With 4" cables rise time is about 24 ns.
- Cutting cables by half reduces rise time to about 17 ns.
- New (thicker) cables on order should reduce the rise time further
- Will check rise time with new cables on order.