Difference between revisions of "May 12, 2011 SiPM Electrical and Cooling"
From GlueXWiki
(→Tentative Agenda) |
(→Action Items from previous meetings) |
||
| Line 6: | Line 6: | ||
# Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories. | # Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories. | ||
| − | # Check bowing with FEA | + | # <strike> Check bowing with FEA </strike> |
# PCB dummy power load for thermal test. | # PCB dummy power load for thermal test. | ||
Revision as of 15:11, 12 May 2011
References
Action Items from previous meetings
- Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories.
-
Check bowing with FEA - PCB dummy power load for thermal test.
Tentative Agenda
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- SiPM testing (Carl and Yi)
- Mechanical (Jim)
- Mechanical drawings (Chuck)
- Geometry (Elton)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
Minutes
Attending:
