May 12, 2011 SiPM Electrical and Cooling

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Revision as of 18:10, 5 May 2011 by Elton (Talk | contribs) (→‎Tentative Agenda)

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References

Action Items from previous meetings

  1. Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories.
  2. Check bowing with FEA
  3. PCB dummy power load for thermal test.

Tentative Agenda

  1. Announcements
  2. Action Items
  3. Schedule, reporting, and manpower (Elton)
  4. SiPM testing (Carl and Yi)
  5. Mechanical (Jim)
  6. Mechanical drawings (Chuck)
  7. Geometry (Elton)
  8. Temperature compensation (Jack)
  9. Preamp-summing (Fernando)

Minutes

Attending:

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