Mar 3, 2011 SiPM Electrical and Cooling

References

• Dynamic Range (See section 6 under simulations)

Action Items from previous meetings

1. Provide thermistor data sheet to Jim (Jack)
2. Get cable specs to Jim (Fernando)
3. Send "U" board to Fernando once finished (Jim)

Tentative Agenda

1. Announcements
2. Schedule, reporting, and manpower (Elton)
3. First article testing (Carl and Yi)
4. Mechanical cooling (Jim)
   • Review status of drawings for prototype (Chuck)
5. Temperature compensation (Jack)
6. Preamp-summing (Fernando)
7. Discussion

Minutes

Attendees:Jack, Carl, Tim, Chuck, Jim, Eugene, John, Elton

1. Announcements
2. Schedule, reporting, and manpower (Elton)
   • No evms updates
3. First article testing (Carl and Yi)
   • Test for first article is ready
   • Elton checked with Hamamatsu and they confirm shipping next week
   • Carl showed slides and went over a proposed list of tests for the first article
     • take dark spectra + 4 runs with different intensities of a calibrated light source
   • Jack: consider obtaining some tools to help remove/install SiPM chips and a static dissipative mat.
   • Elton: asked about checking at least one in a high field. Eugene: one could coordinate with the next solenoid coil test
4. Mechanical cooling (Jim)
   • Discussion at end of session. Need estimate of total number of external cables and connections.
   • Per wedge: Signal cables: 12 fadc cables and 8 disc (both coax). Estimates for low voltage (max 4 pairs) and bias (max 4 pairs). For monitoring (using 1 led/guide) need 40 coax + 40 low voltage pairs (they might all be able to share a single pair input)
   • Review status of drawings for prototype (Chuck)
5. Temperature compensation (Jack)
   • Presented the bias compensation scheme with much discussion
   • Appropriate compensation can be obtained using nominal resister values for components
   • Elton: Need to assess how many variety of boards are needed to achieve desired bias compensation
6. Preamp-summing (Fernando)
7. Discussion