Difference between revisions of "Mar 3, 2011 SiPM Electrical and Cooling"
From GlueXWiki
(→Minutes) |
|||
| Line 23: | Line 23: | ||
== Minutes == | == Minutes == | ||
| − | ''Attendees: | + | ''Attendees:Jack, Carl, Tim, Chuck, Jim, Eugene, John, Elton |
# Announcements | # Announcements | ||
# Schedule, reporting, and manpower (Elton) | # Schedule, reporting, and manpower (Elton) | ||
# [[Test Setup for SiPMs | First article testing]] (Carl and Yi) | # [[Test Setup for SiPMs | First article testing]] (Carl and Yi) | ||
| + | #* Test for first article is ready | ||
| + | #* Elton checked with Hamamatsu and they confirm shipping next week | ||
| + | #* Carl showed slides and went over a proposed list of tests for the first article | ||
| + | #** take dark spectra + 4 runs with different intensities of a calibrated light source | ||
| + | #* Jack: consider obtaining some tools to help remove/install SiPM chips and a static dissipative mat. | ||
| + | #* Elton: asked about checking at least one in a high field. Eugene: one could coordinate with the next solenoid coil test | ||
# Mechanical cooling (Jim) | # Mechanical cooling (Jim) | ||
| + | #* Discussion at end of session. Need estimate of total number of external cables and connections. | ||
| + | #* Signal cables: 12 fadc cables and 8 disc (both coax). Estimates for low voltage (max 4) and bias (max 4) | ||
#* Review status of drawings for prototype (Chuck) | #* Review status of drawings for prototype (Chuck) | ||
| − | # Temperature compensation (Jack) | + | # [http://argus.phys.uregina.ca/cgi-bin/private/DocDB/ShowDocument?docid=1708 Temperature compensation] (Jack) |
| + | #* Presented the bias compensation scheme with much discussion | ||
| + | #* Appropriate compensation can be obtained using nominal resister values for components | ||
| + | #* Elton: Need to assess how many variety of boards are needed to achieve desired bias compensation | ||
# Preamp-summing (Fernando) | # Preamp-summing (Fernando) | ||
# Discussion | # Discussion | ||
Revision as of 18:36, 3 March 2011
References
- Files for discussion
- Hall D BCAL Readout Mechanical Concept (Jim Fochtman)
- Dynamic Range (See section 6 under simulations)
Action Items from previous meetings
- Provide thermistor data sheet to Jim (Jack)
- Get cable specs to Jim (Fernando)
- Send "U" board to Fernando once finished (Jim)
Tentative Agenda
- Announcements
- Schedule, reporting, and manpower (Elton)
- First article testing (Carl and Yi)
- Mechanical cooling (Jim)
- Review status of drawings for prototype (Chuck)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
- Discussion
Minutes
Attendees:Jack, Carl, Tim, Chuck, Jim, Eugene, John, Elton
- Announcements
- Schedule, reporting, and manpower (Elton)
- First article testing (Carl and Yi)
- Test for first article is ready
- Elton checked with Hamamatsu and they confirm shipping next week
- Carl showed slides and went over a proposed list of tests for the first article
- take dark spectra + 4 runs with different intensities of a calibrated light source
- Jack: consider obtaining some tools to help remove/install SiPM chips and a static dissipative mat.
- Elton: asked about checking at least one in a high field. Eugene: one could coordinate with the next solenoid coil test
- Mechanical cooling (Jim)
- Discussion at end of session. Need estimate of total number of external cables and connections.
- Signal cables: 12 fadc cables and 8 disc (both coax). Estimates for low voltage (max 4) and bias (max 4)
- Review status of drawings for prototype (Chuck)
- Temperature compensation (Jack)
- Presented the bias compensation scheme with much discussion
- Appropriate compensation can be obtained using nominal resister values for components
- Elton: Need to assess how many variety of boards are needed to achieve desired bias compensation
- Preamp-summing (Fernando)
- Discussion
