Difference between revisions of "Mar 3, 2011 SiPM Electrical and Cooling"
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== References == | == References == | ||
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* [[May 27, 2010 Calorimetry | Dynamic Range]] (See section 6 under simulations) | * [[May 27, 2010 Calorimetry | Dynamic Range]] (See section 6 under simulations) | ||
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# Announcements | # Announcements | ||
# Schedule, reporting, and manpower (Elton) | # Schedule, reporting, and manpower (Elton) | ||
| + | #* No evms updates | ||
# [[Test Setup for SiPMs | First article testing]] (Carl and Yi) | # [[Test Setup for SiPMs | First article testing]] (Carl and Yi) | ||
#* Test for first article is ready | #* Test for first article is ready | ||
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# Mechanical cooling (Jim) | # Mechanical cooling (Jim) | ||
#* Discussion at end of session. Need estimate of total number of external cables and connections. | #* Discussion at end of session. Need estimate of total number of external cables and connections. | ||
| − | #* Per wedge: Signal cables: 12 fadc cables and 8 disc (both coax). Estimates for low voltage (max 4 pairs) and bias (max 4 pairs). For monitoring (using 1 led/guide) need 40 coax + | + | #* Per wedge: Signal cables: 12 fadc cables and 8 disc (both coax). Estimates for low voltage (max 4 pairs) and bias (max 4 pairs). For monitoring (using 1 led/guide) need 40 coax + 40 low voltage pairs (they might all be able to share a single pair input) |
#* Review status of drawings for prototype (Chuck) | #* Review status of drawings for prototype (Chuck) | ||
| − | # [ | + | # [https://halldweb.jlab.org/doc-private/DocDB/ShowDocument?docid=1708 Temperature compensation] (Jack) |
#* Presented the bias compensation scheme with much discussion | #* Presented the bias compensation scheme with much discussion | ||
#* Appropriate compensation can be obtained using nominal resister values for components | #* Appropriate compensation can be obtained using nominal resister values for components | ||
Latest revision as of 17:13, 24 February 2017
References
- Dynamic Range (See section 6 under simulations)
Action Items from previous meetings
- Provide thermistor data sheet to Jim (Jack)
- Get cable specs to Jim (Fernando)
- Send "U" board to Fernando once finished (Jim)
Tentative Agenda
- Announcements
- Schedule, reporting, and manpower (Elton)
- First article testing (Carl and Yi)
- Mechanical cooling (Jim)
- Review status of drawings for prototype (Chuck)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
- Discussion
Minutes
Attendees:Jack, Carl, Tim, Chuck, Jim, Eugene, John, Elton
- Announcements
- Schedule, reporting, and manpower (Elton)
- No evms updates
- First article testing (Carl and Yi)
- Test for first article is ready
- Elton checked with Hamamatsu and they confirm shipping next week
- Carl showed slides and went over a proposed list of tests for the first article
- take dark spectra + 4 runs with different intensities of a calibrated light source
- Jack: consider obtaining some tools to help remove/install SiPM chips and a static dissipative mat.
- Elton: asked about checking at least one in a high field. Eugene: one could coordinate with the next solenoid coil test
- Mechanical cooling (Jim)
- Discussion at end of session. Need estimate of total number of external cables and connections.
- Per wedge: Signal cables: 12 fadc cables and 8 disc (both coax). Estimates for low voltage (max 4 pairs) and bias (max 4 pairs). For monitoring (using 1 led/guide) need 40 coax + 40 low voltage pairs (they might all be able to share a single pair input)
- Review status of drawings for prototype (Chuck)
- Temperature compensation (Jack)
- Presented the bias compensation scheme with much discussion
- Appropriate compensation can be obtained using nominal resister values for components
- Elton: Need to assess how many variety of boards are needed to achieve desired bias compensation
- Preamp-summing (Fernando)
- Discussion
